SEMICONDUCTOR WAFER-BONDER,

Abstract

A device for bonding semiconductor devices to headers is described. Individual dice are picked up from an indexing disc with a vacuum pencil and positioned over the header. The weight of the pencil serves as a pressure source on the transistor die while the heat is supplied through a filament heater. The bonding operation is carried out in a forming gas atmosphere. Construction of the instrument and operating procedures are described. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1966
Accession Number
AD0634030

Entities

People

  • Robert J. Anstead

Organizations

  • Harry Diamond Laboratories

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Atmospheres
  • Compound Semiconductors
  • Construction
  • Electronic Equipment
  • Electronics
  • Filaments
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics
  • Transistors

Readers

  • Computer Science/Computer Engineering/Data Science/Digital Signal Processing.
  • Integrated Circuit Design and Technology.
  • Plasma Physics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems