PRODUCTION ENGINEERING MEASURE ON 2N3375 SILICON OVERLAY TRANSISTOR.

Abstract

All processing investigations have been completed and the production runs were started early in February. The improvements and modifications in processing incorporated into the production run are; (1) bulk material improvement, (2) surface stability improvement, (3) metallization interface improvement, (4) improved photolithography, (5) improved wafer handling, and (6) hot spot detection. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1966
Accession Number
AD0634048

Entities

People

  • F. Tumbelty
  • J. C. Laberge

Tags

DTIC Thesaurus Topics

  • Bulk Materials
  • Detection
  • Engineering
  • Hot Spots
  • Materials
  • Photolithography
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Transistors

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering