PRODUCTION ENGINEERING MEASURE (PEM) FOR SILICON MIXER DIODE.

Abstract

The third engineering test sample run has been completed using the new package design, thermocompression bonding of two silicon lots and tungsten whiskers with varying wire and point characteristics. Preliminary screening of these units indicate that units with tungsten wire of increased tensile strength can better withstand mechanical and thermal stresses. Step stress analysis of stroage life test data on units from the second run show a failure rate of 0.1% per 1000 hours compared to the objective 0.001% level. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1966
Accession Number
AD0634862

Entities

People

  • C. Brunquell
  • G. Bowne
  • R. Bayliss

Organizations

  • Sylvania Electric Products

Tags

DTIC Thesaurus Topics

  • Engineering
  • Life Tests
  • Mechanical Properties
  • Physical Properties
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Stress Analysis
  • Stresses
  • Tensile Strength
  • Thermal Stresses
  • Tungsten

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.