VIBRATION AND SHOCK TESTING OF MULTILAYER PRINTED WIRING BOARDS,

Abstract

This report covers the vibration and shock test results and procedures which comprised one phase of the multilayer printed wiring board development program. Sample multilayer boards, with and without flatpacks, were subjected to vibration and shock testing preceded by temperature cycling and shock, per MIL-STD 202; these tests were followed by high altitude testing. The boards were subjected to the most rigorous vibration and shock conditions likely to be encountered by electronic assemblied in a manned launch vehicle. There were no through-hole or welded lead connection failures. There was one soldered lead connection failure. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 01, 1966
Accession Number
AD0634871

Entities

People

  • A. Koudounaris

Organizations

  • Douglas

Tags

DTIC Thesaurus Topics

  • Altitude
  • High Altitude
  • Launch Vehicles
  • Shock
  • Shock Tests
  • Vehicles
  • Vibration

Readers

  • Electrical Engineering
  • Structural Dynamics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems