MICROELECTRONIC SOLID-STATE DISPLAY ASSEMBLY.

Abstract

The purpose of this program was to perform configuration and fabrication studies which might improve the performance of CdSe-EL display panels. Treatment parameters, handling, and conditions of application of the CdSe were also studied with regard to their influence on the variability of the hysteresis effect. The configuration studies included a comparison of the sandwich structure and gap structure constructions of CdSe-EL panels. The sandwich structure was found to be more practical to fabricate. The fabrication techniques that were investigated included studies on binders, solvents, curing procedures, temperature and humidity effects, postfire treatments, sizes and types of wire electrodes, packing density, the occurrence of electrical and optical cross-coupling of CdSe-EL panels was also performed. The most significant results were obtained in the postfire treatment experiments and in the investigations of cross-coupling. As found in the postfire treatments, the proper treatment can increase the threshold to cutoff ratio of a particular batch of CdSe. It was also found that various specific treatments can reduce the degree of variation (in hysteretic behavior) from batch to batch. The investigations of cross-coupling showed that better performance can be obtained from CdSe-EL panels if electrical and optical isolation between CdSe elements is provided. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 07, 1966
Accession Number
AD0634911

Tags

DTIC Thesaurus Topics

  • Assembly
  • Construction
  • Couplings
  • Electrodes
  • Fabrication
  • Humidity
  • Hysteresis
  • Packing Density
  • Wet Bulb Temperature

Readers

  • Naval Mine Countermeasure Systems Development.
  • Reinforced Composite Materials
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics