PRODUCTION ENGINEERING MEASURE FOR SILICON OVERLAY TRANSISTORS.
Abstract
The following process steps are described: scribing, die breaking, die bonding, wire bonding, deionized water boil and bake, cascade rinse, bake, and weld. The efforts expended by the Reliability Program Department were in the areas of test performance, electrical parameter measurements, data analysis, and preparation of the 2N2369 specification and Quality Control Plan. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 31, 1966
- Accession Number
- AD0635118
Entities
People
- Michael Cassidy
- Paul Greer
Organizations
- Motorola Mobility