PRODUCTION ENGINEERING MEASURES (PEM) FOR MILLIWAT LOGIC SEMICONDUCTOR INTEGRATED CIRCUITS.

Abstract

Investigation continued on the use of larger double-epitaxial slices for the milliwatt logic process, including the creation of special masks and handling equipment. In order to improve epitaxial film thickness and resistivity, a new reactor was installed, tested, and evaluated. More than twice as many slices are being produced with the new reactor. Assembly flow was improved by installing a two-unit magnetic heater on all bonding machines, adding a process for nickel and duplex gold plating headers to reduce discoloration, and implementing improved techniques for checking temperature and pressure on the bonding machine. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1965
Accession Number
AD0635812

Entities

People

  • D. W. Brooks
  • J. D. Simpson

Organizations

  • Texas Instruments

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Circuits
  • Compound Semiconductors
  • Discoloration
  • Electrical Engineering
  • Electronic Equipment
  • Electronics
  • Engineering
  • Integrated Circuits
  • Manufacturing
  • Mass Production
  • Metal Oxide Semiconductors
  • Modules (Electronics)
  • Production
  • Production Engineering
  • Production Management Methods
  • Semiconductors

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems