PRODUCTION ENGINEERING MEASURE FOR SILICON OVERLAY TRANSISTORS.
Abstract
Progress during the past quarter has consisted of the following: (1) Wafer Preparation: Processing of 1 1/2-inch slurry-polished and chemically etched wafers using the new preohmic two-step photoresist process. (2) Mask Resolution and Alignment: Vertical and horizontal dimensional inspection of masks to eliminate mask variations. (3) Deionized Water Boil: Evaluation of ultrasonically wire-bonded devices after subjection to deionized water boil. (4) Wire Bonding: Evaluation of units fabricated using a Sono Bond ultrasonic bonder. (5) Diffusion Systems: Final evaluation of the BCl3 system. Emitter diffusion employing a controlled POCl3 source temperature. (6) Reliability Evaluation: Evaluation of completed units. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 31, 1965
- Accession Number
- AD0635814
Entities
People
- Michael Cassidy
- Paul Greer
Organizations
- Motorola Mobility