INVESTIGATION OF PLATINGS OF ELECTRICAL CONTACTS.

Abstract

MIL-C-26636 size 16 and 20 pin and socket contacts were electroplated with gold over silver, gold over nickel, gold over copper, rhodium over nickel and rhodium over silver. Plated contacts were wired and assembled in a modified louvered Stevenson Screen and installed at the NASL marine environmental site at Ft. Tilden, N.Y. mounted on a supporting structure facing the ocean without obstruction, approximately 500 feet from the shore line and 40 feet above M.L.W. Analysis of tarnish films deposited on exposed copper plates during the initial two months at the Ft. Tilden test site indicates a suitable marine environment free of sulphide contamination. Contact resistance measurements on contacts mated 100 times as compared to contacts mated once, prior to exposure, show no significant difference except for a 30% increase for those plated with rhodium over nickel. The contact resistance measurements made during the first two months of exposure indicate a slight increase in the average contact resistance of all contacts. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 08, 1966
Accession Number
AD0636193

Tags

DTIC Thesaurus Topics

  • Biological Phenomena
  • Contamination
  • Environment
  • Measurement
  • Resistance
  • Sulfides

Readers

  • Mathematics or Statistics
  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.