PRODUCTION ENGINEERING MEASURE TO IMPROVE PRODUCTION TECHNIQUES AND INCREASE THE RELIABILITY OF THE SCL7004/21 AND SCL7004/22 TRANSISTORS.

Abstract

There are seven planned equipment and process modifications intended to achieve improved VRC-12 reliability by improved resistance to secondary breakdown. The alloyed boat material is 90% converted in terms of alloy caps and 14% in terms of completed boats. The resultant reduction of entrapped volatiles in the regrowth and the better maintenance of geometry is intended to reduce localized hot spots. The wafer washer, now being used as standard production, eliminates residuals and thereby provides similarly improved alloy junction quality. The alloy furnance study was initiated in this quarter and is intended to compliment the other junction improvement items. The thinner copper base is intended to improve operating capability by reducing thermal resistance. The maximum reliability operating area for the 2N2210 transistor and a detailed analysis of the VRC-12 system was completed. Sustaining voltage tests, pulse energy tests, capacitor effects, clamping of the collector diode by zener diodes, initial efforts to determine collector diode energy capability, the reliability of unusual transistor traces, and the effects of the deletion of the center base contact and dissipation testing was evaluated.

Document Details

Document Type
Technical Report
Publication Date
May 31, 1966
Accession Number
AD0636921

Entities

People

  • R. P. Anjard

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accumulators
  • Diodes
  • Electronic Components
  • Electronic Equipment
  • Engineering
  • Hot Spots
  • Materials
  • Production
  • Production Engineering
  • Reliability
  • Resistance
  • Thermal Resistance
  • Transistors
  • Zener Diodes

Readers

  • Electrical Engineering
  • Semiconductor Device Technology
  • Systems Analysis and Design