THIN FILM TECHNIQUES FOR SILICON INTEGRATED CIRCUITS.
Abstract
Motor drive with speed control installed on cermet powder feed mechanism. Cermet depositions on (a) multiple wafer resistance uniformity and (b) reproducibility in a series of experiments to optimize the deposition and process parameters have been completed. One-thousand hour 200C storage tests completed on 21 canned cermet resistors. Continued plasma anodization of aluminum thin films with new substrate heater-holder installed on the system. Measurements for 0.7 pF/sq mil -20 volt plasma anodized capacitors canned and prestorage were completed. The units are now on 1000 hour storage tests. The Reactive Sputtering power supply has been delivered and is now being installed. Masks for the MIC-C44 linear amplifier and the MIC-C50 gate circuit masks were completed. Circular contact Ni-Cr resistors were deposited in several geometrical configurations and evaluated for high frequency characteristics. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1966
- Accession Number
- AD0637216
Entities
People
- Louis E. Terry
Organizations
- Motorola Mobility