PRODUCTION ENGINEERING MEASURES (PEM) FOR MILLIWATT LOGIC SEMICONDUCTOR INTEGRATED CIRCUITS.

Abstract

A bonder certification program was initiated during the last quarter of 1865 to improve process flow by reducing pre-cap inspection requirements. Tests completed in December, 1965, resulted in fabrication of a new scribe head with an improved Tempress diamond, which resulted in increased yields and permitted the operator to make necessary adjustments. Work continued on adjusting millivolt offset between a minimum of 15 and a maximum of 50. This program was continuing at the end of the quarter. Pyrolytic oxide was added after emitter to improve contact probe yields and increase pinhole protection. This process was added to the production process. Permission was granted to Texas Instruments on February 9, 1966, by 'the sponsoring agency' to start a qualification program. The first automatic probe system from the Transistor Automation Corporation was delivered the latter part of February, 1966. It was in full operation by March 1, 1966. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 30, 1966
Accession Number
AD0637448

Entities

Organizations

  • Texas Instruments

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Automatic
  • Automation
  • Circuits
  • Compound Semiconductors
  • Corporations
  • Electrical Engineering
  • Electronics
  • Engineering
  • Fabrication
  • Inspection
  • Integrated Circuits
  • Metal Oxide Semiconductors
  • Performance Tests
  • Production
  • Production Engineering
  • Production Management Methods
  • Semiconductors

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics