PHYSICS OF FAILURE IN ELECTRONICS. VOLUME 4
Abstract
The purpose of the meeting was to exchange information on fundamental physical and chemical processes which contribute to degradation, aging, and failure of electronic parts and materials. Emphasis was placed on the application of this information to the problems of reliability control, measurement, prediction, and improvement. Papers were presented at six half-day sessions as follows: Session I - Interconnections; Session II - Test, Analysis, and Correlation; Session III - Device Physics; Session IV - Surface Effects; Session V - Bulk Effects; Session VI - Minuteman II CQAP Program. Included in this volume are also a number of standby papers which were not presented at the symposium.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1966
- Accession Number
- AD0637529
Entities
People
- Joseph Vaccaro
- M. E. Goldberg
Organizations
- Rome Laboratory