HIGH RELIABILITY MICROCIRCUIT MODULES.

Abstract

Reliability of the Hamilton Standard MicroCircuit Module was studied. MicroCircuit Modules containing only transistors, containing transistors and thin film resistors and capacitors and containing functioning circuits (both hybrid and monolithic circuits) were studied. The tests consisted of high temperature storage, thermal cycling and mechanical environmental stress. The results of these tests were compared to the results of similar tests on identical transistors (fabricated in the same diffusion run) packaged in TO-18 cans. The study showed that the microcircuit module packaging scheme is as reliable as the TO-18 can. More specifically, it was found that the failure rate for transistors packaged in the microcircuit module and stored at 150C was 0.028%/1000 hours. The effect of the formation of gold-aluminum intermetallic compounds at the junction of gold leads and aluminum contact films is discussed. It is shown that proper process control can reduce but not eliminate this effect. This study has shown that highly reliable hybrid and monolithic circuits can be packaged in the Hamilton Standard MicroCircuit Module, offering substantial weight and volume reduction for complex electronic systems. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1966
Accession Number
AD0637819

Entities

People

  • A. R. Riben
  • R. E. Antalik

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum
  • Circuits
  • Film Resistors
  • Films
  • High Reliability
  • High Temperature
  • Intermetallic Compounds
  • Microcircuits
  • Reliability
  • Resistors
  • Standards
  • Thin Film Resistors
  • Thin Films
  • Transistors

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics