INTERCONNECTING TECHNIQUES FOR TELEPHONE COMMUNICATION EQUIPMENT.

Abstract

The objective of this work was to develop electrical connectors for use with flat flexible cable. Plug and receptacle type connectors and adapters for hermetic feed thru and printed circuit board applications were required. The first phase of this work was the evaluation of three methods of contacting the conductors of the cable without stripping the insulation. Insulation piercing sawtooth contacts that make a sliding siping contact were selected. The second phase resulted in development models of a plug, Hermetic feed thru, and ultra-miniature printed circuit connector adapter. These models were laboratory tested to ascertain electrical capabilities; favorable results were recorded. The design and manufacture of Engineering models constituted the third phase of the work. The design consists of molded plastic inserts within non-magnetic metal housings and sawtooth type contacts to pierce the cable insulation as in the development models. Considerable difficulty was encountered in attempting a hermetic seal of 0.016 diameter pins on 0.050 inch centers. Testing of many materials resulted in the selection of molybdenum for the pins. The final phase was the evaluation of the Engineering Models. Qualification tests were performed to the proposed specification. These tests indicated good electrical qualities, but some problems in the areas of environmental sealing and alignment of contacts for closed entry purposes. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1966
Accession Number
AD0637831

Entities

People

  • Mark Auriana
  • Richard P. Stelling

Tags

DTIC Thesaurus Topics

  • Circuit Boards
  • Circuits
  • Communication Equipment
  • Connectors
  • Electrical Engineering
  • Electronic Equipment
  • Engineering
  • Hermetic Seals
  • Insulation
  • Materials
  • Printed Circuit Boards
  • Printed Circuits
  • Test And Evaluation
  • Test Equipment

Readers

  • Computer Science/Computer Engineering/Data Science/Digital Signal Processing.
  • Optical Fiber Sensing and Electromagnetic Propagation.
  • ballistics.

Technology Areas

  • Microelectronics