CORDWOOD MODULE EVALUATION PROGRAM. REVISION B.

Abstract

The Cordwood modules designed are typified by high-density packaging of standard, military-approved components that are assembled by conventional methods. Densities of 200,000 components per cubic foot have been achieved with the relatively low-cost, standard components. The modules are fabricated by stacking components perpendicularly between two printed-circuit boards and encapsulating the entire assembly in epoxy resin. The encapsulated module has a cubical shape. Component leads extending from one side of the cube are used for external connections. After encapsulation, the modules can operate reliably under extreme environmental conditions -- 100 percent humidity, temperatures from -55 degrees C to 85 degrees C, and shock and vibration to 100 g. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 26, 1962
Accession Number
AD0640156

Tags

DTIC Thesaurus Topics

  • Assembly
  • Circuit Boards
  • Circuits
  • Electronic Equipment
  • Encapsulation
  • Epoxy Resins
  • High Density
  • Humidity
  • Packaging
  • Printed Circuit Boards
  • Printed Circuits
  • Resins
  • Standards
  • Test And Evaluation
  • Vibration

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