EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.

Abstract

The initial study of some of the basic constraints to be applied to Flip/Chip modules has been completed. Masks for the preparation of experimental samples have been designed and sample substrates and chips are being prepared. Ultrasonic welding equipment has been installed and is operational. A few samples have been bonded. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 14, 1966
Accession Number
AD0640670

Tags

DTIC Thesaurus Topics

  • Circuit Interconnections
  • Circuit Testers
  • Circuits
  • Electrical Circuits
  • Electrical Equipment
  • Electronic Circuits
  • Electronic Equipment
  • Integrated Circuits
  • Modules (Electronics)
  • Substrates
  • Test And Evaluation
  • Test Equipment
  • Ultrasonic Welding
  • Welding

Readers

  • Instructional Design and Training Evaluation.
  • Integrated Circuit Design and Technology.