PHOTOELASTIC ANALYSIS OF SHEAR STRESS DISTRIBUTION IN ADHESIVE-BONDED LAP JOINTS

Abstract

A photoelastic analysis was made of the shear stress distribution in an .064-inch aluminum alloy, adhesive-bonded lap joint. The adhesive that was used was a photoelastic material. The stress distribution was studied directly on the adhesive itself in the joint as a function of increasing load and length of overlap of the adherends. The experimental distribution that was obtained was compared with that predicted by the theoretical analysis of Goland and Reissner.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1962
Accession Number
AD0640857

Entities

People

  • Dieter Kutscha

Organizations

  • Forest Products Laboratory

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Aluminum Alloys
  • Applied Mechanics
  • Cameras
  • Elastic Properties
  • Films
  • Light Sources
  • Materials
  • Mechanical Properties
  • Mechanics
  • Modulus Of Elasticity
  • Photographs
  • Shear Modulus
  • Shear Stresses
  • Stress Analysis
  • Stress Concentration
  • Stresses

Fields of Study

  • Engineering

Readers

  • Structural Dynamics.
  • Surface Coatings Technology.