THE EFFECT OF CHEMICAL ADDITIVES ON THE ELECTRON DENSITY OF PLASMA JETS.

Abstract

Three chemical means for reducing the electron density in a plasma sheath were investigated. These methods were: the addition of electrophilic atoms or radicals, the addition of micron size refractory dust particles, and the addition of substances that will undergo an endothermic reaction in the plasma. Several hydrocarbons, sulfur hexafluoride, water vapor, and submicron silicon oxide, aluminum oxide, aluminum and carbon particles were injected into air and nitrogen plasmas at pressures varying between 30 and 2.5 inches Hg. The change in X-band microwave transmission across the plasma was noted. Among all the compounds used, sulfur hexafluoride was found to be the most effective in improving transmission and this was attributed to the presence of highly electrophilic fluorine atoms. It was at least fifteen times as effective as water, on a mole basis, and therefore about twice as effective on a weight basis. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1965
Accession Number
AD0643815

Entities

People

  • Alamin Hoodbhoy
  • Sami Atallah
  • Wayne A. Sanborn

Organizations

  • Tufts University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum
  • Aluminum Oxides
  • Electron Density
  • Electrons
  • Endothermic Reactions
  • Microwave Transmission
  • Oxides
  • Particles
  • Plasma Jets
  • Plasma Sheaths
  • Water Vapor
  • X Band

Fields of Study

  • Chemistry

Readers

  • Electrochemical Engineering/ Fuel Cell Technologies
  • Plasma Physics.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics