COST RELIABILITY FACTORS IN HYBRID CIRCUIT PACKAGING,

Abstract

Factors that affect reliability, (1) materials, (2) chip mounting techniques, (3) connecting techniques; a comparative reliability rating; factors that affect cost, (1) assembly techniques, (2) alinement techniques, (3) repairability, (4) yield; comparative cost rating; hybrid packing figure of merit.

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1966
Accession Number
AD0643969

Entities

People

  • John E. Mccormick

Organizations

  • Rome Laboratory

Tags

DTIC Thesaurus Topics

  • Assembly
  • Circuits
  • Figure Of Merit
  • Hybrid Circuits
  • Manufacturing
  • Mass Production
  • Materials
  • New York
  • Packaging
  • Production
  • Ratings
  • Reliability

Readers

  • Inertial Navigation Systems.
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design