PROCEEDINGS OF THE CONFERENCE ON RELIABILITY OF SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS, VOLUME II, 17, 18 AND 19 JUNE 1964, NEW YORK, N. Y.

Abstract

Contents: Elimination of gross particles; A closure welder for nontubulated semiconductors; Development and application of hot hydrogen mounting furnace; Development and application of accelerated temperature testing; Analytical empirical surface studies; The chemistry and physics of semiconductor reliability; Reliability improvement of germanium electrochemical transistors; Statistical analysis of electronic parts reliability test data; Reliability improvement of electrochemical transistors; Step stress test for high power transistors; Life testing methods employed to demonstrate reliability improvement; Establishment of optimum diffusion control; Uniform metal evaporation; Small ball bonding; Process surveillance a tool for improving in-process quality conformance.

Document Details

Document Type
Technical Report
Publication Date
Jun 19, 1964
Accession Number
AD0645222

Entities

Organizations

  • Office of the Director

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Chemistry
  • Electronic Components
  • Integrated Circuits
  • New York
  • Physics
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Statistical Analysis
  • Stress Tests
  • Test Methods
  • Transistors
  • Transition Temperature

Fields of Study

  • Engineering

Readers

  • Semiconductor Device Technology
  • Software Engineering
  • Theoretical Analysis.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene