THIN FILM MICROCIRCUIT INTERCONNECTIONS.
Abstract
An evaluation was made of thin film interfacial interconnections and insulating crossovers. The interconnections were subjected to -55C, 125C, and 200C storage for 1000 hrs. 100 thermal cycles from -65C to 125C; and an accelerated aging at 240C (Interfacial Interconnections) or 300C (crossovers). In addition, the interfacial interconnections were subjected to an operational life test and the crossovers to an operational humidity cycling test. The adhesion and compatability of the film combinations were studied. Eight interfacial combinations were investigated. The fabrication, measuring, analytical, and evaluation techniques are discussed. Based on these studied, several criteria have been established for the evaluation of interfacial interconnections. Based on these studied, several criteria have been estabfor the evaluation of interfacial interconnections. The electrical parameters studied were the d.c. and a.c. interfacial resistance, the rectification ratio, and the current carrying capability of the interconnection. Five combinations are equally acceptable and recommended for use. They are: (top conductor first) Cr/CrAu, CrAu/CrAu, Al/TaAl, CrAu/Cr, Al/Cr. Three are unacceptable, and not recommended for use. They are: TaAl/CrAu, Al/CrAu, CrAu/TaAl. The crossover geometry, along with the measuring and analytical techniques are discussed. The electrical parameters studied were: the d.c. insulation resistance, the 1000 Hz capacitance and dissipation factor, the d.c. breakdown voltage and the withstanding voltage. Several criteria have been established for the evaluation of crossovers.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1967
- Accession Number
- AD0647947
Entities
People
- Harold M. Greenhouse
- Robert T. Galla
- Theodore H. Yaffe
- William C. Vergara
- Winfield W. Richardson