CURING OF EPOXY RESINS WITH COLLOIDAL LEAD,

Abstract

New materials, representing homogenized, stably aggregated systems are formed during the development of colloidal particles by electrolytic or thermal decomposition of lead formate methods in the presence of epoxy resins. The presence of colloidal lead in such systems results in their curing under heating. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1967
Accession Number
AD0648403

Entities

People

  • E. M. Natanson
  • Yu. I. Khimchemko
  • Z. R. Ulberg

Tags

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Composite Materials
  • Decomposition
  • Epoxy Resins
  • Films
  • Materials
  • Particles
  • Plastics
  • Polymeric Films
  • Reinforced Plastics
  • Resins
  • Specialty Uses Of Chemicals
  • Thermosetting Plastics

Readers

  • Aerosol Science/Aerosol Physics
  • Analytical Chemistry
  • Reinforced Composite Materials