COMPLEMENTARY HEATING OF DENSELY PACKAGED MICROCIRCUITS.

Abstract

Some microcircuits dissipate as much as equivalent circuits using discrete transistors and resistors. Dense packaging and the resultant complementary heating therefore create reliability problems similar to those experienced with discrete components. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 06, 1967
Accession Number
AD0650032

Entities

People

  • H. F. Dean

Organizations

  • Navy Electronics Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuits
  • Electronic Components
  • Electronic Equipment
  • Electronics
  • Equivalent Circuits
  • Microcircuits
  • Networks
  • Packaging
  • Reliability
  • Resistors
  • Transistors

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Space/Atmospheric Physics.

Technology Areas

  • Microelectronics