A DIFFUSION BONDING PROGRAM.
Abstract
An evaluation was made of diffusion bonding processes and techniques. The use of evaporated aluminium patterns on polyimide ('H') film provided the interconnecting metallization. This report summarizes the work, including the development of optimum bonding parameters, the fabrication of a significant number of bonds, and the testing of these bonds. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1967
- Accession Number
- AD0651545
Entities
People
- Henry Baker
- P. R. Clark
Organizations
- Honeywell International, Inc.