RF BONDING IMPEDANCE STUDY

Abstract

The significant factors affecting bonding impedance at high frequencies are examined and the reactance of the bonding structure is shown to be the major contributor. Resonant effects caused by stray capacitances are examined and an equivalent circuit is presented to explain the experimentally observed variation with frequency of the bonding impedance. Several techniques for the reduction of bonding impedance are described and experimentally evaluated. A technique for continuous visual display of bonding impedance versus frequency is presented and its suitability for field use is noted.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1967
Accession Number
AD0651549

Entities

People

  • H. W. Denny
  • W. B. Warren

Organizations

  • Georgia Tech

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Capacitance
  • Circuits
  • Electrical Impedance
  • Electronic Equipment
  • Equivalent Circuits
  • Frequency
  • Impedance
  • Insensitive Explosives
  • Insertion Loss
  • Materials
  • Measurement
  • Networks
  • Reactance
  • Resonant Frequency
  • Test And Evaluation
  • Test Fixtures

Fields of Study

  • Physics

Readers

  • Metallurgy
  • Microwave Engineering.