DESIGN PARAMETERS AND PROCEDURES FOR FUNCTIONAL ELECTRONIC STRUCTURES.

Abstract

An empirical calibration of oxide thickness as a function of phosphorus concentration was determined for steam oxidation at 700C for 16 hrs. These calibrating values are regarded as marginally useful in determining impurity profiles by oxidizing a bevel through the diffused layer. Hot hydrogen gas was shown to be an effective reagent for cleaning furnace tubes in situ and for erasing tube history. Both p and n-channel MOS transistors were fabricated in a silicon monolith, using two diffusions only. The electrical performance is sensitive to surface conditions and difficult to control or reproduce. The compromises required in using only two diffusions seem not to be worth the cost in reduced control. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 01, 1967
Accession Number
AD0651654

Entities

People

  • Robert P. Donovan

Organizations

  • RTI International

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Calibration
  • Chemical Compounds
  • Diffusion
  • Elements
  • Hydrogen
  • Impurities
  • Nonmetals
  • Ores
  • Oxidation
  • Oxides
  • Oxygen Compounds
  • Phosphorus
  • Surface Properties
  • Thickness
  • Transistors

Readers

  • Computational Modeling and Simulation
  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene