MICROELECTRONICS ENGINEERING. DESIGN, FABRICATION, MATERIALS AND PACKAGING.

Abstract

Content: Design considerations and methods using advanced electronic fabrication techniques; A survey of microelectronic technology; Vacuum technology; Guidelines for design and layout of thin-film circuits; Functional design using microelectronic techniques; Common materials encountered in microelectronics; Heat transfer design considerations for microelectronic modules; Microelectronic electrical connection techniques; Microelectronic packaging techniques. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1965
Accession Number
AD0652388

Entities

Organizations

  • Naval Air Warfare Center, Indianapolis

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Engineering
  • Fabrication
  • Films
  • Heat Transfer
  • Materials
  • Microelectronics
  • Packaging
  • Thin Films

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene