RELIABILITY TEST PROGRAM OF ULTRASONIC FACE DOWN BONDING TECHNIQUE

Abstract

A study was made to determine the overall reliability of its face-down-bonding process and to determine whether the bonding process damages the chip. The ultrasonic direct-bonding process was used to fabricate approximately 900 test samples for this study. Samples were subjected to the following tests: shear, mechanical shock, thermal shock, vibration, centrifuge, high-temperature storage, elevated-temperature back bias, step stress and comparison, and temperature and humidity. Defective units were examined for causes of failure. The test results indicate that the stresses applied during bonding do not affect circuit operation. The bond failure rate was high, but the distribution of failures suggests that this was due to inadequate substrate process control rather than inherent problems with face-down bonding. The substrate interconnect wires corroded in high-temperature and high-humidity ambients. Several potential solutions to this problem are suggested.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1967
Accession Number
AD0655781

Entities

People

  • Robert P. Moore

Organizations

  • Sperry Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Centrifuges
  • Circuit Boards
  • Diagrams
  • Failure Mode And Effect Analysis
  • High Humidity
  • High Temperature
  • Humidity
  • Logic Gates
  • Materials
  • Printed Circuits
  • Reliability
  • Schematic Diagrams
  • Shock
  • Test And Evaluation
  • Test Equipment
  • Thermal Shock
  • Visual Inspection

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Structural Health Monitoring of Composite Structures.