PRELIMINARY RESULTS OF THERMAL SHOCK TESTS ON PRINTED WIRING,

Abstract

Two printed wiring XXXP Formica boards fabricated by the photo-etching process were put through fifty cycles of thermal shock by lowering the temperature to -40F. and then raising the temperature as quickly as possible to +200F. Power was applied to the 10 circuits on each board at all times. No lifting, cracking, or breaking of the circuits was observed. The plastic remained unharmed. A slight rolling of the plug contacts was noted. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 23, 1953
Accession Number
AD0658134

Entities

People

  • C. D. Smith
  • I. B. Irving

Organizations

  • Johns Hopkins University Applied Physics Laboratory

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Shock
  • Shock Tests
  • Thermal Shock

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Polymer Science and Engineering.