MICROELECTRONIC ELEMENTS IN SHIP AUTOMATION,
Abstract
A review of the foreign progress in miniaturization of electronic circuits is presented. To provide increased reliability, to save cost, size weight, and to accelerate development work, electronic construction evolved from separate production of each element to unit construction of subassemblies, while semiconductor devices replaced tubes. Today, much construction is based on thin film and solid (integral) circuits, and microminiaturization will be further extended by the development of molecular electronics. In the thin film circuits, 200-500 A layers of metal, dielectric, and insulating materials are alternately deposited on ceramic or glass bases. The deposition can be done by thermal vaporization, by cathode sputtering, or by electromechanical plating. The greatest difficulty stems from the fact that transistors, diodes, and high-rated capacitors for inductance cannot be included in the film. In the solid circuits the electronic components are embedded in or attached to the surface of a semiconductor crystal, which is a system of n-p junctions of a specified geometry. In molecular electronics the fundamental units are designed on the bases of the magnetic and electric fields, of the spin and interaction values of the voltage field, and of the charges inside the crystal lattice. The Seebeck, Peltier, and Hall effects are used in this work. Molecular electronics permits a component density 100 times greater than that of solid circuits. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 18, 1967
- Accession Number
- AD0661394
Entities
People
- A. P. Makarov
Organizations
- National Air and Space Intelligence Center