RELIABILITY SCREENING AND STEP-STRESS TESTING OF DIGITAL-TYPE MICROCIRCUITS.
Abstract
The effectiveness of thermal infrared mapping and nondestructive electrical tests for reliability screening was tested on 100 specimens of an industrial grade digital-type microcircuit. It was shown that more effective screening tests are needed, as a number of early failures were not predictable by the test methods employed. It was also shown that microcircuit containers may be opened for inspection and testing without degrading their reliability. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1967
- Accession Number
- AD0662197
Entities
People
- H. F. Dean
- K. F. Harper