MICROMINIATURE MONOLITHIC CROSSPOINT INTERCONNECTIONS.
Abstract
The report describes the techniques used for fabricating a 1 x 4 microminiature crosspoint. It also presents results from electrical tests made on 1 x 1 and 1 x 4 crosspoints. A general discussion of process steps for manufacturing beam-lead diodes is given, followed by descriptions of the deposition and etching of chromium resistors and the gold interconnection patterns, mounting of monolithic logic chips, ultrasonic wire bonding, mounting of beam-lead diodes and the final packaging of a 1 x 4 crosspoint. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1967
- Accession Number
- AD0664126
Entities
People
- L. Spann
- M. Kalet
- S. C. Yuan
- W. H. Buchsbaum