STUDY OF MICROMECHANICAL PROPERTIES OF ADHESIVE BONDED JOINTS.

Abstract

The second quarterly report gives a program to measure the mechanical properties of adhesive bonded joints, utilizing advanced high precision microstrain techniques. During the current report period, progress was noted as follows: (1) The tensile behavior of Epon 9601, a sheet adhesive, was investigated for several sheet thicknesses. The deformation was found to be viscoelastic and the dielectric constant was strain sensitive. (2) The effect of temperature on the tensile properties of Epon 9601 was studied in the temperature range -10 to 200F. The effective tensile modulus increased at low temperatures and the deformation became elastic. At elevated temperatures, plastic flow was observed at low stresses. (3) Tensile tests were made with the Epon 828/Versamid 140 system using aluminum adherends instead of stainless steel. This change resulted in higher fracture stresses and cohesive failure as opposed to adhesive failure for the stainless steel. (4) The shear moduli and fracture stresses of several thicknesses Epon 9601 were measured using the napkin ring torsion apparatus. (5) The dependence of the effective tensile modulus on joint thickness for the system Epon 828/Versamid 140 is explained on the basis of a layered structure within the joint, which influences its mechanical properties. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 15, 1968
Accession Number
AD0664170

Entities

People

  • John L. Rutherford
  • Michael C. Franzblau

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Bonded Joints
  • Dielectric Permittivity
  • Joints
  • Low Temperature
  • Mechanical Properties
  • Plastic Flow
  • Stainless Steel
  • Steel
  • Stresses
  • Tensile Modulus
  • Tensile Properties
  • Thickness

Fields of Study

  • Materials science

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Polymer Science and Engineering.
  • Structural Health Monitoring of Composite Structures.