THERMAL INSULATION OF SMALL INSTRUMENTATION PROBES.

Abstract

Some methods of preventing the rapid overheating of small instrumentation packages or probes when placed in a high temperature (200C) environment are presented in this report. Long term operation (greater than 30 minutes) requires active cooling and involves either greatly increased size or loss of independence of operation. The existing state of thermoelectric cooling is studied and rejected as a means of active cooling in this application. Short term operation (less than 30 minutes) is feasible using standard forms of insulation and heat sinks. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1967
Accession Number
AD0665951

Entities

People

  • T. W. Chubb

Organizations

  • Royal Aircraft Establishment

Tags

DTIC Thesaurus Topics

  • Cooling
  • Environment
  • Heat Sinks
  • High Temperature
  • Instrumentation
  • Insulation
  • Thermal Insulation
  • Thermoelectric Cooling

Readers

  • Computer Science/Computer Engineering/Data Science/Digital Signal Processing.
  • Energy Conservation and Renewable Energy Engineering.
  • Plasma Physics.

Technology Areas

  • Microelectronics