Effect of Curing Temperature on the Thermal Degradation of an Epoxide Polymer

Abstract

A conventional bisphenol-A epoxide was cured with m-phenylenediamine under five different curing temperatures. The thermal degradation of the cured and uncured resins took place at both constant temperature and constant heating rate. The thermal stability, based on the overall energy of activation and the order of reaction, was generally higher for the resin cured at a higher temperature. The highest curing temperature was 200 deg C.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1968
Accession Number
AD0666212

Entities

People

  • H. T. Lee

Organizations

  • Picatinny Arsenal

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Arrhenius Equation
  • Body Weight
  • Calorific Value
  • Chemistry
  • Conversion
  • Degradation
  • Energy
  • Equations
  • Flow Rate
  • Heat Of Activation
  • New Jersey
  • Phenylenediamines
  • Standards
  • Thermal Stability

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.