PLANAR COAXIAL INTERCONNECTION TECHNIQUES
Abstract
Materials and fabrication techniques were developed for a multilayer planar coaxial structure which is applicable for interconnecting subassemblies and assemblies utilized in computers operating in the 20- to 50-MHz range. Improved etching techniques, dielectric systems, conductor applications, lamination methods, through-hole plating technology, and microbonding were investigated. The experimental developmental model designed for this Phase I effort is a pseudorandom code generator. Manufacturing specifications for the multilayer structure were established and documented with regard to material requirements, sources of supply, fabrication processes, and design guides for equipment, special tooling, and parts.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1968
- Accession Number
- AD0667368
Entities
People
- Howard L. Parks
- Tom Kitaguchi
- William Griff