EFFECTS OF ULTRASONIC VIBRATIONS ON TRANSISTORS IN SUBASSEMBLIES.

Abstract

The effects of an ultrasonic cleaning technique for removal of epoxy-type conformal coatings on printed wiring assemblies were investigated. The sample assemblies included (1) a standard comb-type printed wiring test pattern for evaluation of dielectric withstanding voltage, insulation resistance and Q, and (2) representative military type transistors mounted on printed wiring boards for evaluation of hFE and ICBO. (Author)

Document Details

• Document Type: Technical Report
• Publication Date: Oct 01, 1967
• Accession Number: AD0667973

Entities

People

• Robert R. Geisler

Organizations

• United States Army Communications-Electronics Command

Tags

DTIC Thesaurus Topics

• Assembly
• Insulation
• Resistance
• Standards
• Test And Evaluation
• Transistors
• Ultrasonic Cleaning
• Vibration

Readers

• Semiconductor Device Technology
• Software Engineering
• Structural Health Monitoring of Composite Structures.

Technology Areas

• Microelectronics
• Microelectronics - Microelectromechanical Systems