THERMOCOMPRESSION BONDING OF GOLD WIRE FOR MICROELECTRONIC CIRCUITS,

Abstract

The report details a technique for interconnecting master die integrated circuits using thermocompression bonding. Primary coverage is given to specific results achieved and the techniques used. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 26, 1967
Accession Number
AD0671879

Entities

People

  • Thomas E. Higbie

Organizations

  • Naval Air Warfare Center, Indianapolis

Tags

DTIC Thesaurus Topics

  • Circuits
  • Compression
  • Electrical Circuits
  • Electrical Equipment
  • Electronic Circuits
  • Electronic Equipment
  • Electronics
  • Integrated Circuits
  • Thermocompression

Readers

  • Integrated Circuit Design and Technology.
  • Radar Systems Engineering.

Technology Areas

  • Microelectronics