TECHNOLOGY FEASIBILITY SPACECRAFT (TFS), TECHNOLOGY REPORT. VOLUME I. ELECTRONIC PACKAGING.

Abstract

An electronic packaging program was initiated to develop and evaluate integrated circuit packaging techniques applicable to unmanned scientific spacecraft data systems. This was accomplished by a design, develop and demonstrate approach through engineering, manufacturing, and testing for a space environment. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1967
Accession Number
AD0673563

Entities

People

  • L. Parham

Organizations

  • Martin Marietta

Tags

Communities of Interest

  • Autonomy
  • Space

DTIC Thesaurus Topics

  • Circuits
  • Electrical Engineering
  • Engineering
  • Environment
  • Integrated Circuits
  • Manufacturing
  • Packaging
  • Space Environments
  • Space Systems
  • Spacecraft
  • Unmanned
  • Vehicles

Fields of Study

  • Engineering
  • Physics

Readers

  • Software Engineering

Technology Areas

  • Autonomy
  • Microelectronics
  • Space