ADHESION INTERACTION IN A VACUUM OF REFRACTORY METALS, METAL-LIKE COMPOUNDS AND HARD ALLOYS (ADGEZIONNOE VZAIMODEISTVIE V VAKUUME TUGOPLAVKIKH METALLOV, METALLOPODOBNYKH SOEDINENII I TVERDYKH SPLAVOV),

Abstract

Pairs of similar and dissimilar metals were formed by bringing into contact specimens of Ti, Zr, Nb, Ta, Mo, W and Co under a load of 4-5 kg in a vacuum of 0.0001-0.00001 mm Hg at temperatures up to 0.7 T sub mel (T sub mel is the melting temperature of the low-melting component of the pair). The paired specimens contacting each other at their end faces were held under the load for 3 min and then pulled apart to determine the adhesion interaction between them. The ratio of the applied load to the force required to break the joint, tentatively designated the 'adhesion coefficient,' was used as the criterion of the adhesion capacity of the tested materials. Similar tests were also made on specimens of TiC, VC, Cr3C2, NbC, Mo2C, WC, and CrB sintered carbides and borides and also on specimens of VK-8B, VK-11B, VK-15, and VK-15M sintered tungsten carbide-base hard alloys. All tested combinations of similar and dissimilar materials at definite temperatures exhibited adhesion interaction in vacuum, which appeared to be a common phenomenon for all crystalline solid bodies. Adhesion interaction of similar pure metals began in the 0.3-0.4 T sub mel range; dissimilar pure metals began to interact in the 0.35-0.45 T sub mel range. The adhesion interaction of similar pure metals was found to depend on their electron structure. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 21, 1967
Accession Number
AD0674694

Entities

People

  • A. P. Semenov
  • V. V. Pzodnyakov

Organizations

  • National Air and Space Intelligence Center

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Bodies
  • Carbides
  • Coefficients
  • Electrons
  • Materials
  • Metals
  • Refractory Metals
  • Solid Bodies
  • Tungsten
  • Tungsten Carbides

Readers

  • Brain and Cognitive Science; Experimental Psychology; Cognitive Neuroscience
  • Information Retrieval
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics