R AND D OF THE TECHNOLOGIES REQUIRED TO DESIGN AND FABRICATE ULTRAHIGH-SPEED COMPUTER SYSTEMS

Abstract

A research and development program directed toward the development of technologies for high speed computer subsystems is described. Increases in the yield of low power, high speed, high density ECL complex logic arrays, made possible by improved multilevel interconnection technologies, are reported. Multichip high speed LSI subsystems have been assembled by face-down bonding. Computer aid has been incorporated into a system for designing and generating photomasks for complex high speed microcircuits. Results are given for a high speed, high density transistor read only memory.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1968
Accession Number
AD0676025

Entities

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Circuits
  • Computer Programs
  • Computer-Aided Design
  • Computers
  • Contracts
  • Drafting
  • Fabrication
  • Geometry
  • Heat Energy
  • High Density
  • Large Scale Integration
  • Microcircuits
  • Microelectronics
  • Resistance
  • Schematic Diagrams
  • Test And Evaluation

Fields of Study

  • Engineering
  • Physics

Readers

  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics