INVESTIGATION OF SEMICONDUCTOR SCHOTTKY BARRIERS FOR OPTICAL DETECTION AND CATHODIC EMISSION,

Abstract

The photoemissive yield of holes from Au into p-type Si obeys the Fowler relationship from threshold (h nu o = 0.28 eV) up to about 0.46 eV where the yield is 0.8% at 77K for an unmatched diode with a Au pad 0.016 in. in diameter. At higher photon energies, the yields are less than the Fowler values. The yield is 4.3% at 1.0 eV. The yield is smaller for larger diameter Au pads. The photoemissive yield per unit area is 10- to 20-fold greater at the edge than in the central region of Au contacts to n-type Si, as determined by scanning with a 0.001 in. light spot. Varying the rate and duration of Au evaporation or heat treating n-type diodes up to 400C have only minor influences on yield. Surface processing of p-type Ge has been developed for fabricating Au contacts. The thickness of the residual film on the etch-polished surface is about 13A. An efficiency of .000062 was measured for cathodic emission from a cesiated Ag-ZnSe diode. Because of large excess currents, this value may be several orders of magnitude less than can be realized. A practical Ag-ZnS vehicle has been developed. The voltage-current characteristics of Ag contacts to ZnSe and ZnS degrade during the heat treatment required for vacuum bake-out. A similar degradation probably occurs for Ni contacts, but not for Pt contacts. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1968
Accession Number
AD0678162

Entities

People

  • Jerome Cohen
  • Jueri Vilms
  • Robert J. Archer

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Compound Semiconductors
  • Degradation
  • Detection
  • Diameters
  • Efficiency
  • Electronics
  • Emission
  • Energy
  • Evaporation
  • Heat Energy
  • Heat Treatment
  • Optical Detection
  • Residuals
  • Scanning
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Physics

Readers

  • Plasma Physics.
  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics