GRAPHICS

Abstract

A BCPL compiler is being transferred to the TX-2 from Project MAC. A microprogramming assembler has been written, and microcodes can be generated for a prototype processor under construction. The operation of the microcodes and the instruction sets they define can be simulated. An easily trainable public character recognition service has been made available to the TX-2 users community, and it can be called directly from LEAP programs. The mask design facility has been improved and used to generate artwork for several test circuits. In addition, development of an IBM 360 capability has continued to the point of real use by Laboratory personnel. The AMBIT/G programming system has been refined in that drawn programs are themselves AMBIT/G data graphs. The Waveform Processing and RSP projects have been completed. The TIC testing terminal is being augmented with a small stand-alone computer. The logic design and simulation programs have been further developed to permit the input of data, observation of values, and generation of test sequences for the circuit under design. The conic display generator has had a major speed improvement, and storage scopes are being added to all TX-2 consoles.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1968
Accession Number
AD0679991

Entities

People

  • Jack I. Raffel

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Character Recognition
  • Compilers
  • Computer Programming
  • Computer Programs
  • Computers
  • Construction
  • Diagrams
  • Generators
  • Instructions
  • Microcode
  • Microprogramming
  • Models
  • Programming Languages
  • Prototypes
  • Recognition
  • Simulations
  • Simulators

Readers

  • Computer Science.
  • Computer Science/Computer Engineering/Data Science/Digital Signal Processing.
  • Energy Conservation and Renewable Energy Engineering.