BONDING OF FLUID AMPLIFIER SYSTEMS WITH A DRY-FILM ADHESIVE,
Abstract
The report describes an improved system for bonding and sealing fluid amplifiers. The principal feature of the new system is an experimental dry-film adhesive, which consists of a plastic support film coated with a nontacky epoxy resin adhesive; this film is die-cut to shape and cured in place between the amplifier halves. A secondary feature is an adhesive gasket of a commercial foamable epoxy resin designed to seal the connector tubes in place. Bonding and sealing are done simultaneously, which also represents an advance in the state of the art. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1968
- Accession Number
- AD0681250
Entities
People
- Eleanor F. Horsey
- Timothy J. Kilduff
Organizations
- Harry Diamond Laboratories