Thermal Shock Analysis of Standard Hardware Modules

Abstract

The report is a theoretical analysis of stresses exerted on connector pin solder joints of NAFI Standard Hardware Modules, Style 1-A, during thermal shock due to varying coefficients of expansion between adjacent materials. An estimate is also made of the solder joint strength and a comparison made between the two. Although both sets of calculations are worst case analyses (maximum thermal stress vs. minimum joint strength for temperature extremes of -55 degrees C to +125 degrees C), it appears that the solder joint will always withstand forces equal to several times those induced by thermal elongation.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1968
Accession Number
AD0682484

Entities

People

  • Gregory F. Homicz

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Books
  • Circuit Boards
  • Coefficients
  • Deflection
  • Electronic Materials
  • Elongation
  • Heat Sinks
  • Joints
  • Materials
  • Physical Properties
  • Shear Modulus
  • Shear Strength
  • Shear Stresses
  • Shock
  • Standards
  • Stresses
  • Thermal Shock

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Software Engineering
  • Thermal Physics or Thermal Science.