FRACTURE MECHANISMS IN POLYCRYSTALLINE NONMETALLIC MATERIALS.

Abstract

Fracture phenomena and their relation to dislocations and dislocation motion were studied during the course of the investigation. High-purity single crystals were stressed up to 60,000 psi. Although cracks formed in the crystals, no etch pits or associated dislocation motion was observed. X-ray techniques and transmission electron microscopy of thin films prepared by ion bombardment are proposed for determining dislocation velocity stress relationships. Present results indicate that the impurities play a major role in dislocation behavior in alumina and their presence is essential for formation of etch pits. Polycrystalline Lucalox of 5 micron, 20 micron, and 30 micron grain size was fractured at room temperature, 400, 700, and 1000C. Extensive cleavage and intercrystalline fracture were observed using the Scanning Electron Microscope. The extent of cleavage decreased with increase in temperature and grain size. These results are explained in terms of temperature dependence of fracture stress for cleavage and grain boundary fracture, stress concentration at sharp-edged pores, and favorable orientations of some grains relative to the loading axis for cleavage. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1968
Accession Number
AD0686301

Entities

People

  • N. M. Parikh
  • O. Johari

Organizations

  • IIT Research Institute

Tags

DTIC Thesaurus Topics

  • Crystals
  • Dislocations
  • Electron Microscopes
  • Electron Microscopy
  • Films
  • Grain Boundaries
  • Grain Size
  • Ion Bombardment
  • Materials
  • Microscopes
  • Microscopy
  • Scanning Electron Microscopes
  • Single Crystals
  • Stress Concentration
  • Thin Films
  • Transmission Electron Microscopy

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene