YIELD IN DISPERSION HARDENED COPPER ALLOYS.

Abstract

Single crystals of copper containing dispersed particles of alumina and silica have been tested in tension, to determine how dislocations pass oxide particles intersecting their slip planes. Tensile tests were conducted on five alloys at various temperatures from 78K to 1170K. The strain rate sensitivity and the effect on flow stress of diffusing 10 wt % Zn into the Cu matrix were measured over the same temperature range. Thin foils for transmission electron microscopy were prepared from the gauge lengths of the strain crystals to examine dislocation structures and the size and spacing of oxide particles. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1968
Accession Number
AD0686450

Entities

People

  • G. Dorey

Organizations

  • Royal Aircraft Establishment

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Alloys
  • Copper
  • Copper Alloys
  • Crystals
  • Dislocations
  • Dispersions
  • Electron Microscopy
  • Electrons
  • Microscopy
  • Optical Analysis
  • Particles
  • Sensitivity
  • Single Crystals
  • Strain Rate
  • Transmission Electron Microscopy

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics
  • Space