R AND D OF THE TECHNOLOGIES REQUIRED TO DESIGN AND FABRICATE ULTRAHIGH- SPEED COMPUTER SYSTEMS

Abstract

A research and development program was directed toward the development of fabrication technologies for high-speed computer subsystems. High-yield technologies for fabricating high-speed, high-density microcircuit and two-level microcircuit array structures have been developed and demonstrated. Design requirements for small-geometry three-level arrays have also been established. Multichip high-speed LSI subsystems have been assembled by face-down bonding, and characterized for speed and thermal properties. Computer aid has been incorporated into a system for designing and generating photomasks for complex high-speed microcircuits. A simple high-speed ECL gate and a complex, high-speed, high-density transistor Read-Only Memory were successfully designed and fabricated to demonstrate the technique.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1969
Accession Number
AD0686477

Entities

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Boards
  • Circuits
  • Computers
  • Diagrams
  • Epitaxial Growth
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Geometry
  • Heat Energy
  • Laminar Flow
  • Materials
  • Orientation (Direction)
  • Printed Circuits
  • Resistance
  • Schematic Diagrams
  • Test And Evaluation
  • Test Methods

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Microelectronics