COMPOSITE MICROELECTRONIC RESEARCH,

Abstract

An approach to microminiaturization of electronic devices by utilizing uniform size components of .100 in. diameter by .062 in. thickness is presented. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 21, 1961
Accession Number
AD0686492

Entities

People

  • U. Hammer

Organizations

  • General Dynamics

Tags

DTIC Thesaurus Topics

  • Composite Materials
  • Diameters
  • Geometry
  • Mathematics
  • Microminiaturization
  • Physical Properties
  • Thickness

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene